Products - Guangzhou Innomu Technology Co., Ltd.

High elastic modulus AlSiC composite, prepared by powder metallurgy process

Density~2.81 g/cm³

Elastic Modulus≥100 GPa

Yield Strength≥400 MPa

Tensile Strength≥500 MPa

Elongation≥5%

Thermal Conductivity≥130 W/(m·K)

Phone Battery Cover Camera Bracket Fan Housing

Higher elastic modulus, suitable for premium smartphone frame applications

Density~2.85 g/cm³

Elastic Modulus≥136 GPa

Yield Strength≥550 MPa

Tensile Strength≥610 MPa

Elongation≥2%

Thermal Conductivity≥140 W/(m·K)

Premium Phone Frame Precision Bracket

PM aluminum alloy, high elongation in as-extruded condition, excellent bending performance

Density~2.60 g/cm³

Elastic Modulus≥60 GPa

Yield Strength≥220 MPa

Tensile Strength≥350 MPa

Elongation≥17%

Thermal Conductivity≥140 W/(m·K)

Deep Drawing Parts Complex Curved Parts

High strength after heat treatment, good elongation

Density~2.85 g/cm³

Elastic Modulus≥70 GPa

Yield Strength≥480 MPa

Tensile Strength≥560 MPa

Elongation≥10%

Thermal Conductivity≥110 W/(m·K)

Phone Frame Laptop Parts

Ultra-high thermal conductivity PM pure aluminum, thermal conductivity up to 220 W/(m·K)

Density~2.71 g/cm³

Elastic Modulus70 GPa

Yield Strength≥160 MPa

Tensile Strength≥205 MPa

Elongation≥7%

Thermal Conductivity≥220 W/(m·K)

IGBT Substrate LED Heat Sink Speaker Diaphragm

Model	Density (g/cm³)	Elastic Modulus (GPa)	Tensile Strength (MPa)	Thermal Conductivity (W/m·K)	Main Applications
SCA253	~2.81	≥100	≥500	≥130	Battery Cover, Camera Bracket
SCA247	~2.85	≥136	≥610	≥140	Premium Phone Frame, Precision Bracket
PA625	~2.60	≥60	≥350	≥140	Deep Drawing, Complex Curved Parts
PA701	~2.85	≥70	≥560	≥110	Phone Frame, Laptop Parts
PA101	~2.71	~70	≥205	≥220	IGBT Substrate, LED Heat Sink